Microscopy Conference 2023

Mapping local phonon modes in silicon grain boundaries at atomic resolution

IM 2: Spectroscopy

Aberration correctors, electron energy-loss spectroscopy (EELS) and energy-dispersive X-ray spectroscopy (EDX) are nowadays indispensable tools for obtaining atomic-scale information of chemical composition and bonding in materials. Not only can material phases be identified, but important effects such as interdiffusion between phases, or charge ordering, to name but a few, can be studied. In the past decade, in EELS low energy losses were intensively used to identify surface plasmons in nanomaterials, even in a tomographic approach. This was made possible by the implementation of electron monochromators into the electron gun. Recent technological advances have opened the energy-loss window into the sub-10 meV regime where a range of new phenomena can now be studied. These include phonons, low-energy plasmons, and possibly many more low-energy excitations in materials. The wealth of information generates new grand challenges in understanding and modelling the underlying fundamentals of signal generation and intelligent processing of large data sets. Contributions are invited on hardware and technique developments, theory and simulation, data processing as well as applications covering both physical and biological sciences.

Spectroscopy

Abstract talk

MS 3: Low-dimensional and quantum materials

Mechanisms for radiation damage in biological specimens revealed by vibrational EELS

IM 4: Development of cryo-EM instrumentation and techniques

Technological advances steadily push the limits of cryo-electron microscopy (cryo-EM). In recent years, novel developments in cryo-EM instrumentation as well as newly established workflows enabled groundbreaking insights in both, life sciences and material sciences.
In this session we will discuss new developments in experimental cryogenic techniques, cryo-sample preparation as well as instrumental capabilities applied across different fields.
Contributions are welcome from, but not restricted to, the following areas: SEM, FIB, TEM, STEM and CLEM at cryogenic temperatures, including hardware improvements, cryo-stages, cryogenic sample preparation techniques used for EM, measurements of local temperature as well as image processing for cryo-EM.


Katia March

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