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MC 2023
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DE
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Martin Sláma
Brno / CZ
TESCAN ORSAY HOLDING, a.s.
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Date
Speaker
02/03/2023
12:45
–
13:45
50 Min.
10 Min.
Industry talk
Achieve the highest quality and througput in TEM lamella preparation using TESCANs automation and unique lift out method
Further involvements
28/02/2023
18:45
–
19:15
25 Min.
5 Min.
Invited talk
WS2.002-invited
Faster mm-scale defect/failure analysis by combining plasma FIB milling and laser ablation
Workshop 2: Tricks and pitfalls for FIB sample preparation in materials and life sciences
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