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  • P 33

Vibration measurement for the characterisation of osseointegration of implants

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Session

Poster Exhibition

Themen

  • Clinical applications and translation
  • Implant associated

Mitwirkende

Jan Wietzel (Jena, DE), Sibylle Voigt (Jena, DE), PD Dr. Gerlind Schneider (Jena, DE)

Abstract

Abstract text (incl. figure legends and references)

Introduction

To determine bone integration of an implant into the bone (osseointegration), optical methods (CT, MRT) are currently mainly used. However, this is insufficient due to the low resolution or, in the case of metallic implants, due to the high artefact load. Impending implant failure (e.g. due to loosening or defect) is rarely detected.

Objectives

The determination of osseointegration by means of vibrations has so far only existed for dental implants due to the e access. A first step towards the transfer to the interior of the body is the reduction to a simplified laboratory test section with fixed framework conditions. The aim is to test and optimise hardware components and to develop algorithms for evaluation in order to generate quantitative parameters for osseointegration.

Materials and methods

A measuring section and two different types of implant carriers were developed for the test. The measuring section includes a holding device that restricts the movement of the implant carrier and can thus simulate different degrees of adhesion. The experimental set-up is evaluated using a digital oscilloscope, which is operated by software (TiePie and Matlab) via PC. The used sensors only generate very small voltages, so they have to be amplified using special amplifiers (in-house development).

Results and Conclusion

The first vibration measurements could be carried out after some modifications of the measuring section. The results were promising and are currently being evaluated. Further tests and measurements with various other sensors and actuators are currently in preparation. The testing of further parameters (e.g. shape of the implant carrier, clamping, etc.) will take place soon.

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